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DISCRETE SEMICONDUCTORS
DATA SHEET
PEMB13; PUMB13 PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
Product specification Supersedes data of 2003 Dec 11 2004 Apr 15
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
FEATURES * Built-in bias resistors * Simplified circuit design * Reduction of component count * Reduced pick and place costs. APPLICATIONS * Low current peripheral drivers * Replacement of general purpose transistors in digital applications * Control of IC inputs. DESCRIPTION PNP/PNP resistor-equipped transistors (see "Simplified outline, symbol and pinning" for package details). PRODUCT OVERVIEW PACKAGE TYPE NUMBER PHILIPS PEMB13 PUMB13 Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China. SIMPLIFIED OUTLINE, SYMBOL AND PINNING SOT666 SOT363 EIAJ - SC-88 45 B*5 MARKING CODE
PEMB13; PUMB13
QUICK REFERENCE DATA SYMBOL VCEO IO TR1 TR2 R1 R2 PARAMETER collector-emitter voltage output current (DC) PNP PNP bias resistor bias resistor TYP. - - - - 4.7 47 MAX. -50 -100 - - - - UNIT V mA - - k k
NPN/PNP COMPLEMENT PEMD13 PUMD13
NPN/NPN COMPLEMENT PEMH13 PUMH13
PINNING TYPE NUMBER PEMB13 PUMB13
6 5 4
SIMPLIFIED OUTLINE AND SYMBOL PIN
6 5 4
DESCRIPTION emitter TR1 base TR1 collector TR2 emitter TR2 base TR2 collector TR1
1 2 3
R1 TR1 R2
R2 TR2 R1
4 5 6
1
Top view
2
3
1
MAM477
2
3
2004 Apr 15
2
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PEMB13 PUMB13 - - DESCRIPTION plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads
PEMB13; PUMB13
VERSION SOT666 SOT363
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per transistor VCBO VCEO VEBO VI collector-base voltage collector-emitter voltage emitter-base voltage input voltage positive negative IO ICM Ptot output current (DC) peak collector current total power dissipation SOT363 SOT666 Tstg Tj Tamb Per device Ptot total power dissipation SOT363 SOT666 Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. Tamb 25 C note 1 notes 1 and 2 - - 300 300 mW mW storage temperature junction temperature operating ambient temperature Tamb 25 C note 1 notes 1 and 2 - - -65 - -65 200 200 +150 150 +150 mW mW C C C - - - - +5 -30 -100 -100 V V mA mA open emitter open base open collector - - - -50 -50 -10 V V V PARAMETER CONDITIONS MIN. MAX. UNIT
2004 Apr 15
3
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
THERMAL CHARACTERISTICS SYMBOL Per transistor Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Per device Rth j-a thermal resistance from junction to ambient SOT363 SOT666 Notes Tamb 25 C note 1 note 1 Tamb 25 C note 1 notes 1 and 2 PARAMETER CONDITIONS
PEMB13; PUMB13
VALUE
UNIT
625 625
K/W K/W
416 416
K/W K/W
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL ICBO ICEO IEBO hFE VCEsat Vi(off) Vi(on) R1 R2 ------R1 Cc PARAMETER collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain saturation voltage input-off voltage input-on voltage input resistor resistor ratio collector capacitance IE = ie = 0; VCB = -10 V; f = 1 MHz CONDITIONS VCB = -50 V; IE = 0 VCE = -30 V; IB = 0 VCE = -30 V; IB = 0; Tj = 150 C VEB = -5 V; IC = 0 VCE = -5 V; IC = -10 mA IC = -5 mA; IB = -0.25 mA VCE = -5 V; IC = -100 A VCE = -0.3 V; IC = -5 mA MIN. - - - - 100 - - -1.3 3.3 8 - TYP. - - - - - - -0.6 -0.9 4.7 10 - MAX. -100 -1 -50 -170 - -100 -0.5 - 6.1 12 3 pF mV V V k UNIT nA A A A
2004 Apr 15
4
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
PACKAGE OUTLINES
Plastic surface mounted package; 6 leads
PEMB13; PUMB13
SOT666
D
A
E
X
S
YS HE
6
5
4
pin 1 index A
1
e1 e
2
bp
3
wMA Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT666
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 01-01-04 01-08-27
2004 Apr 15
5
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
PEMB13; PUMB13
Plastic surface mounted package; 6 leads
SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2004 Apr 15
6
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
PEMB13; PUMB13
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Apr 15
7
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/03/pp8
Date of release: 2004
Apr 15
Document order number: 9397 750 13102

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